Architecture: 2x Zen 4 , 4x Zen 4c;AMD Configurable TDP (cTDP): 45-65W;Processor Technology for CPU Cores: TSMC 4nm FinFET;CPU Compute Die (CCD) Size: 137mm²;Package Die Count: 1;CPU Boost Techn
Architecture: 2x Zen 4 , 4x Zen 4c;AMD Configurable TDP (cTDP): 45-65W;Processor Technology for CPU Cores: TSMC 4nm FinFET;CPU Compute Die (CCD) Size: 137mm²;Package Die Count: 1;CPU Boost Techn